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Carbodeon develops NanoDiamond composite thermally conductive thermoplastics with 20%-100% improvement in thermal conductivity. New materials and processes reduce NanoDiamond costs by up to 70%.
Carbodeon's uDiamond nanodiamond materials can now achieve a 20 percent increase in polymer thermal performance by using as little as 0.03 wt.% nanodiamond material at 45 percent thermal filler loading, enabling the further performance at a lower cost than made with traditional fillers. Samples were manufactured at VTT Technical Research Centre of Finland and their thermal performance was analyzed by ESK (3M) in Germany.Last October, the company published its data on thermal fillers showing that the conductivity of polyamide 66 (PA66) based thermal compound could be increased by 25 percent by replacing 0.1 wt.% of the typically maximum effective level of boron nitride filler (45 wt.%) with the company’s application fine-tuned nanodiamond material. The latest refinements in nanodiamond materials and compound manufacturing allow similar performance improvements with 70 percent less nanodiamond consumption and thus, reduced cost.The active surface chemistry inherent in detonation-synthesised nanodiamonds has historically presented difficulties in utilising the potential benefits of the 4-6nm particles, making them prone to agglomeration. Carbodeon optimises this surface chemistry so that the particles are driven to disperse and to become consistently integrated throughout parent materials, especially polymers. The much-promised properties of diamond can thus be imparted to other materials with very low, and hence economic, concentrations.More information: www.carbodeon.com