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Zenite and Vectra LCPs Meet ‘Material Challenge’ in Samtec SEAMSEAF High Speed, High Density Series

News International-French

4 Apr 2013

When Samtec Inc. was designing and developing its SEAM/SEAF Series of high speed, high density connectors, it turned to Ticona, the engineering polymers business of Celanese Corporation, and its family of liquid crystal polymers (LCP) to resolve a processing and assembly challenge.

“Our SEARAY™ high density, open pin field grid arrays presented an interesting material challenge— we needed a proven halogen free high performance polymer that could withstand technology for improved solder joint reliability and ensure compatibility with lead-free reflow processes and environmental initiatives,” said Doug McCartin, HUB engineering manager at Samtec Inc., a worldwide manufacturer of electronic interconnects.
Samtec, which had sampled several competitive materials with little success, worked with Ticona to identify two solutions from a family of halogen-free, high-performance polymers — Zenite® 6130LX for the SEAM Series, which is the mate to the SEAF Series that is injection molded with Vectra® E135i.

The SEAM/SEAF Series with high pin count from Samtec provides telecommunication, data communication, high-end computer, industrial and medical customers with the flexibility in their design and routing process that helps them meet their specific electrical performance requirements. For example, to isolate a signal for a high speed application, some use many circuits for grounds, while others combine multiple close proximity circuits for power.

Ticona Material Knowledge Delivers
“In addition to having the world’s largest LCP product line, Ticona supports customers in their product development efforts with initial part design, computer modeling and simulation, prototyping, tooling consultation, testing and part validation,” said Ruth Castillo, Vectra and Zenite LCP global business director — Ticona. “In this case, we were able to identify two LCPs that met Samtec’s performance criteria for weldline strength and excellent processability, including lead free solderability.”
Zenite 6130LX, a 30 percent glass reinforced, lubricated LCP resin with a unique combinations of toughness, stiffness, dimensional stability and creep resistance — even at very high temperatures, offers:
- Improved weldline strength
- Improved flatness
- Improved toughness, heat deflection temperature of 280 degrees Celsius

Vectra E 135i, a 35 percent glass fiber filled LCP resin with improved flatness, heat resistance, flow and toughness, offers:
- Low warp
- High flow
- High mechanical strength
- Superior weldline performance

Inherently flame resistant without the need for halogenated flame retardant additives, the Zenite and Vectra product line includes innovative grades that keep pace with market needs for thinner walls, higher temperature resistance, higher production rates, lower overall part costs and recyclability. As highly crystalline, thermotropic (melt-orienting) thermoplastics, they can withstand SMT soldering temperatures, including those needed with lead-free solder.
“As a global solution provider with more than 50 years of material, component design and processing expertise, Ticona was able to help Samtec resolve their material challenges,” Castillo at Ticona said. “Both Zenite and Vectra LCP grades met their needs — a material solution that is halogen free and delivers improved solder joint reliability.”


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